Chamfering and sideplating
This option is available if non-pooled manufacturing in Germany is selected.
You can choose between 20° PCI and 45° ISA. Top and bottom is always chamfered in the process. Please also follow the information for electroplated gold.
Note: the depth of the chamfer depends on the thickness of the PCB.
We offer sideplating for the outer edges of your circuit boards. We kindly ask you to follow the design parameters to ensure flawless production:
In your layout data, the circuit board edge to be sideplated must be marked with 500µm of protruding copper. A connection of at least 300µm must also be defined.
Layers that are not to be connected should have a clearance of at least 800µm on the outer contour.